Paul Dalley

Principal Scientist

Dexco Polymers

Personal Biography

Paul Dalley is a Principal Scientist in the Adhesive Polymers Business at TSRC-Dexco located in Plaquemine, LA. Paul has over twenty-years of experience in formulating hot melt adhesives and has worked for Bostik, H.B. Fuller and Dow Automotive. Paul joined TSRC Dexco in August, 2012. Since joining TSRC Dexco, Paul has been studying the relationship of styrenic block co-polymer structure on the rheological and PS properties of hotmelt adhesives. Paul graduated from Hope College in 1985 with a B.S. in Chemistry and obtained a Masters in Polymer Chemistry from the University of Detroit-Mercy in 1992. In 2006 Paul obtained a J.D. from Marquette University Law School and holds licenses for the State of Wisconsin, and the United States Patent and Trademark Office.

Presentation Abstract

Novel SIS polymers for oil-free hotmelt labels

Mineral oils such as saturated hydrocarbons (MOSH) and mineral oil aromatic hydrocarbons (MOAH) are materials available to hotmelt label formulators. Moreover, MOSH oils are widely used in hotmelt label formulae. The EU, however, has recommended monitoring of MOSH and MOAH in materials and articles that come into contact with food. Additionally, the German Ministry of Food, Agriculture, and Consumer Protection, is drafting an ordinance banning the use of mineral oil in printing inks for food packaging. In light of this trend, food label adhesives cannot be far behind. Thus, it would be beneficial to formulate label adhesives without the use of MOSH or MOAH materials. TSRC/Dexco has developed novel SIS polymers that will help the hot melt adhesive formulator meet these upcoming challenges. These new polymers will allow the formulator to remove MOSH and MOAH materials from their PSA’s. This paper will discuss the structure - property relationships of these novel polymers; provide formulation methodology; and provide numerous example formulae.


Co-authors: Mark Berard, Ph.D. Karen Oelschlaeger, & Robert Gibson

Presentation Time

Breakout II: Safe adhesives for food packaging

Thursday, 13 September 2018, 15:00 - 15:30

FEICA Conference