Dr André Ebbers

Director Applied Technology Hotmelts

Evonik Resource Efficiency GmbH

Personal Biography

Dr André Ebbers studied Physics and completed a Doctorate in semiconductor physics in 2003. He started his career as Laboratory Manager and Project Manager for printed electronics, solar and lithium ion technologies at Degussa AG. In this position he was responsible for university cooperation as well as material and process development. In 2010 Dr Ebbers joined Evonik Resource Efficiency GmbH as Head of Applied Technology VESTOPLAST® Hot Melts.

Presentation Abstract

Improved amorphous poly-alpha-olefins (APAOs) in hot melt applications

Traditional VESTOPLAST® grades have been well known by the market for years. In a recent innovation, Evonik has filled a blind spot in its portfolio and designed two new polymers maintaining the advantages of the known grades and improving properties such as flowability of the granules at the same time.

The two new polymers possess a unique molecular structure and polymer properties to address the challenges hot melt formulators are facing today.

With VESTOPLAST® EP V2094 and VESTOPLAST® EP V2103 two grades with a high cohesion despite their low viscosity were created, while maintaining adhesion forces on wood and PP. As a special feature these two polymers show an unusual close proximity of softening point and shear adhesion failure temperature, allowing either savings in melting energy or improvements in temperature resistance. The compatibility with a broad range of tackifiers as well as FT-Hardwaxes is an additional result. In handling, the granules provide excellent flowability while keeping its tackiness. The white colour of the new grades remain stable in formulations and show no sign of degradation, which marks a major benefit for the formulator and the end producer. The new grades can be used in various applications such as hygiene, packaging, mattress bonding or labels.

Based on the recent innovation more developments are in the pipeline with variations in viscosity, temperature resistance or adhesion strengths.

Presentation Time

Breakout IX: Pressure Sensitive Adhesives (PSA)

Friday, 15 September 2017, 10:00 - 10:30

FEICA Conference