With the increasing regulatory pressure and struggle to limit climate change, goods manufacturers are forced to work on the design of their products and foster higher reuse or recycling at the end of life. For bonded assemblies, a very limited mass of material (the adhesive) is a roadblock for easy reuse of most of the assembly mass (the substrates), due to lack of reversibility of the joining technique.
The new debonding primer developed and patented by Rescoll offers a simple and efficient solution to the disassembling of multimaterial assemblies. This technology allows the drastic decrease of the bonding performance upon thermal triggering and dismantling in a very short time at room temperature, with easy cleaning of substrates after debonding (low primer residues, easy to wipe off). This primer allows structural performance (>15MPa) and very low residual strength post debonding (<0.5MPa).
The technology is currently in the validation stage for various case studies with industrial partners. These studies, from the coupon level to demonstrator parts in real industrial environment allow challenging the debonding primer in terms of processing requirements, ageing resistance and recycling potential. Targeted industries are consumer goods (electronics, apparels, shoes) but also high value equipments (aerospace, electric vehicles, …).
Co-authors: Robin SZYMANSKI