Changing substrates and safer materials are amongst the challenges facing and impacting hot melt adhesive producers. These evolving challenges need new innovations to meet both industry and consumers demands. With consumer preferences moving towards more paper packaging and with paper packaging with high level of recycle content being difficult to bond to, hot melt adhesive producers face new challenges in providing the necessary bond performance. This paper will outline a new product offering from Dow that addresses on the one-hand the need for improved bonding performance whilst at the same time anticipating industry and consumer demands for safer materials.
