Dr Sudipto Das

Research Scientist and Global Technical leader for Reactive Hot Melt

H.B. Fuller


Dr. Sudipto Das is the global R&D leader for reactive hot melt technology and global R&D business partner for the woodworking, panels, and composite markets at H.B. Fuller. He has extensive knowledge in the formulation of polyurethane adhesives, specifically reactive hot melt adhesives, for a wide variety of markets such as woodworking, durable assembly, electronics among other. He holds a PhD in polymer science & engineering from Virginia Polytechnic Institute and State University, U.S.

Presentation Abstract

A novel approach to low emission reactive hot melt adhesives

Most polyurethane-based reactive hot melt (RHM) adhesives contain free monomeric diisocyanates, which depending upon their chemical nature, can be hazardous to users when not handled in a safe manner. As of August 2023, the European Authorities under REACH will adopt a stringent labeling requirement and mandatory training for all users of adhesives containing >0.1% of residual monomeric isocyanates. To be ready and address multiple customer concerns in the region, H.B. Fuller has invented a unique, patented approach to achieve RHMs containing <0.1% free monomeric diisocyanates to be used in key markets. Compared to other low monomer RHMs developments, this improved approach leverages economic-wise, commodity raw materials instead of single-sourced, expensive raw materials. It also supports conventional RHM production equipment. H.B. Fuller has been using this route to convert most of the company’s RHM portfolio into the new low monomer versions. These were found to be more sustainable, contributing to lower hazardous emissions, and showed higher initial strength and excellent application stability relative to their conventional counterparts, while also being more cost effective. Currently, these formulations are being used for woodworking applications, but the potential is huge and further developments are already underway for automotive, graphic arts, and electronics.


Co-authors: Daniel Van-Dyke, Matthias Gurr, Annett Linemann, Iñaki Sigler

Presentation Time

Breakout VII: Low diisocyanate monomer PUs

Friday, 16 September 2022, 9:30 - 10:00

FEICA Conference