Allan McLennaghan

Global Application Technology Leader



PhD in Pure and Applied Chemistry from the University of Strathclyde, Scotland. In 1986, he joined Dow Polyolefin Research working in the areas of Polyolefin Product and Process Research and in Application Development. In 1996 with the formation of the DuPont Dow Elastomer joint venture he moved to the DuPont Dow European Technology Centre where he focused on Application Development for the Ethylene Elastomers businesses. From 2005 he has been working as an Application Technology Leader for Hot Melt Adhesives with a global role since 2019.  He is currently based in Spain with Dow.

Presentation Abstract

Reducing the carbon footprint of adhesives and sealants

With the ambition to become one of the most sustainable material science companies, Dow is using a variety of approaches to bring sustainable solutions to the marketplace: Design For Recycling, Mechanical Recycling, Alternative Feedstocks and Advanced Recycling. This paper will give an overview of these approaches and will highlight several current examples from Dow’s product lines of relevance to the adhesives and sealants industries. A particular focus will be placed on Polyolefin Elastomers for hot melt adhesives and how polymer design enables design for recycling, how polymer design can impact carbon footprints during application and how renewable feedstocks can be used to  further reduce the overall carbon footprint and enable more sustainable solutions for the hot melt adhesives market.


Co-authors: Imran Munshi

Presentation Time

Breakout IV: Hotmelt adhesives enabling sustainable solutions

Thursday, 15 September 2022, 16:00 - 16:30

FEICA Conference