Dr Christoph Schnöll

Vice President of Technology

Bodo Möller Chemie GmbH


Christoph Schnöll studied technical chemistry at the Technische Universität Wien and the University of North Carolina at Chapel Hill. He completed his PhD in 2020, specializing in the innovative area of polymer chemistry, focusing on acrylate, polyurethane and epoxy materials. After his time in academia, he entered the private sector and since then is further strengthening the know-how and technology focused sales approach of the Bodo Möller Chemie group, first in sales and now in his current role as Vice President of Technology.

Presentation Abstract

Towards Sustainable and Future-Proof Adhesives: A 3-Step Approach Using Innovative Technology to Target Multiple Challenges along the Value Chain.

The increasing global awareness of limited resources and the need to reduce energy consumption and CO2 emissions are deeply impacting industry. Rising demands from the market, combined with ambitious targets set by international legislators pave the way for innovative new solutions in adhesive bonding technology.

To enable a sustainable future production using adhesives we propose a holistic 3-step approach focusing on the whole value chain: First the raw materials should be obtained from a renewable or recycled source. Therefore, we are introducing the mass balance concept for bio-based epoxy resins, enabling a reduction of the product carbon footprint by up to 85%. Moreover, state-of-the-art packaging is an integral part of an innovative adhesive product and needs to be considered when focusing on sustainability.  The presented cartridge systems are either based on 100% recycled thermoplastics or allow a reduction of waste by up to 75%, using a novel collapsible design. Finally and above all, adhesive bonding needs to be durable and allow straightforward repair and recycling. As a consequence, Debonding on Demand is of great importance, leading us to the introduction of an innovative multi compatible primer system allowing a fast and clean debonding process via thermally induced gas formation.

Presentation Time

Breakout  XIII - Bio-components for Epoxy

Friday, 13 September 2024, 11:00 - 11:30

FEICA Conference